Use for preparing substrates to accept flooring. For use as a patch, underlayment or embossing leveler. Use with almost any substrate. Fast setting. Ready for most floors in 1 to 2 hrs. Non-sanded formula trowels easily for a smooth finish. Non-shrinking. Reduces installation time. Exceeds 5000 psi compressive strength. Bonds to concrete, ceramic tile, quarry tile and terrazzo (except metal terrazzo strips), wood and wood underlayments, clean and abraded steel, stainless steel, brass and lead, primed poured-in-place gypsum subfloors and radiant-heated subfloors where the surface temperature does not exceed 85 deg F.
